Title:
半導体パッケージ基板
Document Type and Number:
Japanese Patent JP4398954
Kind Code:
B2
Abstract:
Disclosed herein is a semiconductor package board, in which a copper pattern having a predetermined shape is formed on a dummy area, thus preventing the entire semiconductor package board from bending. The present invention is technically characterized in that the copper pattern includes a beam part, which is provided in the longitudinal direction of the semiconductor package board, and a rib part, which is provided in the lateral direction of the semiconductor package board.
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Inventors:
Jo Seung Hyun
Kim Han
Gu Zab
John Hyojik
Yoon Ilson
Kim Han
Gu Zab
John Hyojik
Yoon Ilson
Application Number:
JP2006176811A
Publication Date:
January 13, 2010
Filing Date:
June 27, 2006
Export Citation:
Assignee:
Samsung Electric Co., Ltd.
International Classes:
H01L23/12; H05K1/02
Domestic Patent References:
| JP2004172647A | ||||
| JP2004023051A | ||||
| JP2004214430A | ||||
| JP2002033555A |
Attorney, Agent or Firm:
Sota Asahina
Fumio Akiyama
Fumio Akiyama