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Patent Searching and Data


Title:
ポリアミド樹脂水性分散液の製造方法
Document Type and Number:
Japanese Patent JP4404988
Kind Code:
B2
Abstract:
The aqueous dispersion of polyamide resin of the present invention comprises dispersed polyamide resin particles, basic material and water. The dispersed polyamide resin particles have a weight-average diameter of 0.1-10 mu m. The ratio of end carboxyl groups to end amino groups in the polyamide resin is between 60/40 and 100/0. The amount of said basic material added is 0.2-3.0 mol per mol of end carboxyl groups. Such an aqueous dispersion of polyamide resin can be manufactured by adding the polyamide resin to an aqueous dispersion medium containing 0.2-3.0 mol of basic material per mol of end carboxyl groups in the polyamide resin.

Inventors:
Eiichi Araki
Norihiro Sugihara
Kaichiro Nakao
Manabe Koji
Application Number:
JP11305699A
Publication Date:
January 27, 2010
Filing Date:
April 21, 1999
Export Citation:
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Assignee:
Sumitomo Seika Co., Ltd.
International Classes:
C08L77/00; C08J3/03; C08K3/20; C09D11/00; C09D177/00; C09D177/06; C09J177/00; C09J177/06; C10M107/44; C10M173/02
Domestic Patent References:
JP6509824A
JP62243619A
JP5507521A
JP5507114A
JP62010164A
JP2004862A
Foreign References:
US2926117
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka