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Title:
溶融袋
Document Type and Number:
Japanese Patent JP4404990
Kind Code:
B2
More Like This:
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JP6195779An injection molding method, an injection-molding object, and the resin composition for it
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Inventors:
Kenichi Date
Application Number:
JP14713699A
Publication Date:
January 27, 2010
Filing Date:
May 26, 1999
Export Citation:
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Assignee:
Mitsui DuPont Polychemical Co., Ltd.
International Classes:
C08J5/00; B65D30/02; C08L33/00; C08L33/02
Domestic Patent References:
JP11140251A
JP9221571A
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki



 
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