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Title:
パターン形成体の製造方法
Document Type and Number:
Japanese Patent JP4408392
Kind Code:
B2
Abstract:

To provide a manufacturing method of a pattern forming body by which a characteristic of a region not directly irradiated with energy is also changed when a pattern with changed characteristic is formed by semiconductor photocatalyst action associated with energy irradiation by exposing from a base material side of a substrate for patterning where a light shielding section is formed.

The substrate for patterning has a base material, the light shielding section formed on the base material and a semiconductor photocatalyst-containing layer which is formed on the base material so as to cover the light shielding section and which contains at least a semiconductor photocatalyst and a binder. The manufacturing method of the pattern forming body has an energy irradiation process in which a reflection plate and the semiconductor photocatalyst-containing layer of the substrate for patterning are arranged to face each other and the energy irradiation is made from a base material side to form the pattern in which the characteristic of the semiconductor photocatalyst-containing layer is changed to a stripe shape. In the energy irradiation process, reflection energy from the reflection plate irradiating the semiconductor photocatalyst-containing layer is in parallel with some angle to incident energy and further is parallel to the pattern with changed characteristic.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Hironori Kobayashi
Uno Yusuke
Takashi Sawada
Application Number:
JP2004177565A
Publication Date:
February 03, 2010
Filing Date:
June 15, 2004
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
G02B5/20; B01J35/02; G02F1/1335
Domestic Patent References:
JP2001074928A
JP11276558A
JP2001305049A
JP11183700A
Attorney, Agent or Firm:
Akihiko Yamashita
Kishimoto Tatsuto