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Patent Searching and Data


Title:
接着剤付き導体-ポリイミド積層板
Document Type and Number:
Japanese Patent JP4409024
Kind Code:
B2
Inventors:
徳久 極
徳光 明
金子 和明
Application Number:
JP2000023700A
Publication Date:
February 03, 2010
Filing Date:
February 01, 2000
Export Citation:
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Assignee:
新日鐵化学株式会社
International Classes:
B32B15/088; H05K1/03; B32B15/08; B32B27/34; C08G73/10; C08G77/455; C09J179/08; C09J183/10; H01L21/58; H01L23/498; H05K3/46
Domestic Patent References:
JP9123357A
JP11005954A
JP2245029A
JP2036232A
JP11310754A
JP5230213A
JP4206595A
JP7297560A
Attorney, Agent or Firm:
成瀬 勝夫
中村 智廣
佐野 英一