Title:
半導体製造装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4410472
Kind Code:
B2
Inventors:
Shinichi Shimada
Masaaki Ueno
Mitsuhiro Matsuda
Kazuo Tanaka
Miyata Toshimitsu
Hideyuki Tsukamoto
Masaaki Ueno
Mitsuhiro Matsuda
Kazuo Tanaka
Miyata Toshimitsu
Hideyuki Tsukamoto
Application Number:
JP2003015274A
Publication Date:
February 03, 2010
Filing Date:
January 23, 2003
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/22; H01L21/31; H01L21/324
Domestic Patent References:
| JP2000234866A | ||||
| JP2002184790A |
Attorney, Agent or Firm:
Kajiwara Tatsuya