Title:
電子部品のフリップチップアセンブリーに適した接触のためのろう接可能な膜を作る方法
Document Type and Number:
Japanese Patent JP4413278
Kind Code:
B2
Abstract:
Contacts of SAW components are produced which are suitable for flip-chip mounting. Electrically conductive structures on a substrate are tightly encapsulated within a cover and contact pads of the electrically conductive structures are exposed in a window formed in the cover. Solderable layers are vapor deposited onto the contact pads of the electrically conductive structures after the cover is produced.
Inventors:
Pearl, Wolfgang
Sterutsuru, Alois
Kruger, Hans
Sterutsuru, Alois
Kruger, Hans
Application Number:
JP52321297A
Publication Date:
February 10, 2010
Filing Date:
December 16, 1996
Export Citation:
Assignee:
SIEMENS MATSUSHITA COMPONENTS GESELLSCHAFT MIT BESCHRANKTER HAFTUNG & COMPANY KOMMANDITGESELLSCHAFT
International Classes:
H01L21/60; H03H3/08; H01L23/31; H03H3/02
Domestic Patent References:
| JP1213018A | ||||
| JP8316644A | ||||
| JP8213874A | ||||
| JP8078856A | ||||
| JP7086867A | ||||
| JP7086442A | ||||
| JP4293311A | ||||
| JP58139511A |
Attorney, Agent or Firm:
Iwao Yamaguchi