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Title:
構造基板および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4415480
Kind Code:
B2
Inventors:
Kato Gosaku
Nobuyoshi Okano
Application Number:
JP2000333880A
Publication Date:
February 17, 2010
Filing Date:
September 26, 2000
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
H01L21/302; H01L21/306; H01L21/304; H01L21/3065; H01S5/323
Domestic Patent References:
JP6310425A
JP2127648A
JP62136826A
JP2210830A
JP11111670A
Attorney, Agent or Firm:
Yoichiro Fujishima



 
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