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Title:
半導体装置
Document Type and Number:
Japanese Patent JP4423461
Kind Code:
B2
Inventors:
Yuichi Harada
Naoki Kumagai
Shinichi Jimbo
Takuhiro Ikura
Takahiro Sato
Application Number:
JP2003294699A
Publication Date:
March 03, 2010
Filing Date:
August 18, 2003
Export Citation:
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Assignee:
Fuji Electric Systems Co., Ltd.
International Classes:
H01L27/06; H01L29/78; H01L29/786
Domestic Patent References:
JP2002158353A
JP10321853A
JP2002026314A
JP2001298184A
JP7283409A
JP2004031519A
Attorney, Agent or Firm:
Akinori Sakai



 
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