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Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP4429943
Kind Code:
B2
Abstract:

To shorten the tact time of a treatment operation for supplying treatment liquid on a substrate to be treated in a spinless system, and to form the application film of the treatment liquid on the substrate to be treated with uniform film thickness in a floating conveyance system.

When the fluctuation of the vacuum pressure of a vacuum mechanism used for stabilizing floating force is generated, the fluctuation of the vacuum pressure is detected through a pressure sensor by the control circuit of a nozzle height position corrector, and a control signal having fixed response characteristics to the fluctuation of the vacuum pressure is generated, and the driving of a piezoelectric actuator is controlled, and the height position of a resist nozzle is variably controlled according to displacement generated by the piezoelectric actuator. Thus, when a substrate G is displaced upward more than set floating altitude Hb according to the fluctuation of the vacuum pressure of the vacuum mechansim, a resist nozzle 78 is also displaced upward by almost the same displacement quantity in the same timing as that of the displacement of the substrate G, and a gap S between the resist nozzle 78 and the substrate G is held at a set value as a result.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Yoshitaka Otsuka
Takashi Nakamitsu
Application Number:
JP2005076879A
Publication Date:
March 10, 2010
Filing Date:
March 17, 2005
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C5/02; B05C13/02; B05D1/06; B05D3/00
Domestic Patent References:
JP4055347A
JP2000181080A
JP2000072251A
JP2005228881A
JP2006237482A
JP2005132626A
JP2005244155A
JP2006019396A
JP2005274711A
Foreign References:
WO2003086917A1
WO2006077905A1
WO2006090619A1
Attorney, Agent or Firm:
Filial piety Sasaki