To prevent a plurality of plates, which constitute a holder, from warping by rigidly adhering the plurality of plates.
In the holder 21, the insulating two plates 22 and 23 or more are adhered in a layered state by an adhesive 29 in such way that a plurality of through holes 26 and 27 may communicate with each other, and a plurality of support holes for housing conductive contacts in such a way as to freely emerge and retract are formed by the communication of the through holes 26 and 27. Its manufacturing method comprises an adhesive arrangement process for arranging the adhesive 29 in the overall surface of at least one surface of one plate 22; an adhesive removal process for forming hole parts 30 by removing the adhesive 29 from sections opposite to the through hole 26 when the adhesive 29 is in a semi-cured condition; a through hole formation process for forming the through hole 26 through the hole parts 30 of the adhesive 29 in the one plate when the adhesive 29 is in a semi-cured condition; and an adhesion process for adhering the plates 22 and 23 to each other by fully curing the adhesive 29 after the other plate 23 in which the through hole 27 is formed is aligned so that the through holes 26 and 27 may communicate with each other and superposed on the one plate 22.
COPYRIGHT: (C)2005,JPO&NCIPI
JPH04138280 | [Title of the device] Probe |
WO/2013/142806 | LATERALLY DRIVEN PROBES FOR SEMICONDUCTOR TESTING |
JP2023529323 | test socket |
Mitsuhiro Nagaya
JP63019269U | ||||
JP1217738A | ||||
JP2000251049A | ||||
JP2003035722A | ||||
JP2002174643A | ||||
JP2000091391A | ||||
JP2142198A |
WO1999004274A1 |