Title:
パターン形成方法および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4432993
Kind Code:
B2
Abstract:
A method for forming a pattern includes the step of forming an electrically conductive film by applying a liquid composition onto a first plate. The liquid composition includes an organic solvent and conductive particles surface-modified with a fatty acid or an aliphatic amine. Then, a second pattern, which is a reverse pattern of a first pattern, is formed on the first plate by pressing a second plate having a concave-convex pattern on a surface thereof on a surface of the first plate having the electrically conductive film on the surface thereof. Then, the first pattern of the electrically conductive film is transferred onto convex top faces of the second plate. Then, the second pattern is transferred onto a surface of a transfer substrate by pressing the surface of the first plate having the second pattern thereon on the surface of the transfer substrate.
Inventors:
Akihiro Nomoto
Kazumasa Nomoto
Toshio Fukuda
Kazumasa Nomoto
Toshio Fukuda
Application Number:
JP2007106864A
Publication Date:
March 17, 2010
Filing Date:
April 16, 2007
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/288; H01L21/027; H01L21/28; H01L21/336; H01L29/417; H01L29/423; H01L29/49; H01L29/786; H05K3/12
Domestic Patent References:
| JP2004128469A | ||||
| JP2006278845A | ||||
| JP2006173277A |
Attorney, Agent or Firm:
Yoichiro Fujishima
Yasushi Santanzaki
Masao Hasebe
Takaaki Tanaami
Yasushi Santanzaki
Masao Hasebe
Takaaki Tanaami