Title:
赤外線送受信モジュール
Document Type and Number:
Japanese Patent JP4440381
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an infrared transmission/reception module, having connecting terminals which can be jointed to an external circuit board without hindrance, even if a mask for forming, e.g. an insulating layer is loaded out of place. SOLUTION: The infrared transmission/reception module is constructed, such that a plurality of light-emitting elements and light-receiving elements are mounted on a substrate 2 and are integrated using a resin mold, and can be mounted on an external circuit board B. Connecting terminals 7 are formed on the underside of the substrate 2 for jointing with the board B. Each terminal 7 extends in a substantially rectangular form.
Inventors:
Horio Tomoharu
Application Number:
JP24548199A
Publication Date:
March 24, 2010
Filing Date:
August 31, 1999
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L31/12; H01L31/02; H01L33/00; H01L33/52
Domestic Patent References:
| JP10041540A | ||||
| JP9190942A | ||||
| JP10256720A | ||||
| JP6296045A | ||||
| JP11154764A | ||||
| JP7106202A |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Yoshikazu Fukumoto
Tatsuya Tanaka
Yoshikazu Fukumoto