Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4442426
Kind Code:
B2
Inventors:
Horii Shingo
Application Number:
JP2005000466A
Publication Date:
March 31, 2010
Filing Date:
January 05, 2005
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L25/065; H01L23/12; H01L25/07; H01L25/18
Domestic Patent References:
| JP2001345418A | ||||
| JP5299786A | ||||
| JP2001339037A |
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Mitsue Obuchi