Title:
ダイシング・ダイボンドフィルム
Document Type and Number:
Japanese Patent JP4443962
Kind Code:
B2
Abstract:
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec at 23 °C, is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a) < adhesion of the pressure-sensitive adhesive layer (2b), and the adhesion of the pressure-sensitive adhesive layer (2a) to the die-bonding adhesive layer (3) is not higher than 2.3 N/25 mm. There is thus provided the dicing die-bonding film that is excellent in balance between retention during dicing of the thin work and releasability of its diced chipped work together with the die-bonding adhesive layer, even if a work is thin.
Inventors:
Ken Matsumura
Masanori Mizutani
Sadahito Misumi
Masanori Mizutani
Sadahito Misumi
Application Number:
JP2004076732A
Publication Date:
March 31, 2010
Filing Date:
March 17, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/20; C09J133/00; C09J201/00; H01L21/58; H01L21/68
Domestic Patent References:
| JP10335271A | ||||
| JP2265258A | ||||
| JP2003113355A | ||||
| JP2002226796A | ||||
| JP2004134689A | ||||
| JP2004356412A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi