Title:
絶縁ゲート型半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP4447377
Kind Code:
B2
Inventors:
Hidefumi Takatani
Miyagi Kyosuke
Hamada
Tadayoshi Okura
Norihito Tokura
Akira Kuroyanagi
Miyagi Kyosuke
Hamada
Tadayoshi Okura
Norihito Tokura
Akira Kuroyanagi
Application Number:
JP2004158575A
Publication Date:
April 07, 2010
Filing Date:
May 28, 2004
Export Citation:
Assignee:
トヨタ自動車株式会社
株式会社デンソー
株式会社デンソー
International Classes:
H01L29/78; H01L21/336; H01L29/06; H01L29/423
Domestic Patent References:
| JP5506335A | ||||
| JP9283535A | ||||
| JP2004513518A | ||||
| JP6013621A |
Foreign References:
| WO2003015179A1 |
Attorney, Agent or Firm:
Akika Okado
Takashi Tomizawa
Ikuo Yamanaka
Takashi Tomizawa
Ikuo Yamanaka