Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
高周波回路用パッケージ
Document Type and Number:
Japanese Patent JP4454144
Kind Code:
B2
More Like This:
Inventors:
和田 久義
吉田 克亨
白崎 隆行
Application Number:
JP2000390686A
Publication Date:
April 21, 2010
Filing Date:
December 22, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
京セラ株式会社
International Classes:
H01L23/02; H01L23/12; H01P1/00; H01P3/08
Domestic Patent References:
JP11312751A
JP63261859A
JP2000183233A
JP8274512A