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Title:
成型用金型の位置決め装置
Document Type and Number:
Japanese Patent JP4457467
Kind Code:
B2
Abstract:
To provide a template positioning apparatus which requiries no adjusting labor and time and genuinely performing the positioning of a template. A pin 12 is attached to a movable side template 5 and a bush 21 is attached to a fixed side template 4. The outer diameter of the tip part 32 of the pin 12 is fitted to the inner diameter of the first positioning hole 18 of the bush 21. A ball retainer 23 with a diameter d2 provided to the root of the pin 12 through a leaf spring 34 is pressed into the second positioning hole 17 of the bush 21 with an inner diameter D2 in a preloaded state. At the time of mold closing, the pin member is guided by the first positioning hole 18 and the templates are roughly positioned and, immediately before mold closing, the ball retainer is inserted in the second positioning hole 17. The clearance between the ball retainer and the pin/bush is zero and the templates are positioned precisely.

Inventors:
Hiroshi Takeuchi
Iitani Education
Yasuaki Hayashi
Application Number:
JP2000180154A
Publication Date:
April 28, 2010
Filing Date:
June 15, 2000
Export Citation:
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Assignee:
Futaba Electronics Co., Ltd.
International Classes:
B29C33/22; B29C45/26
Domestic Patent References:
JP9070831A
JP4000429U
JP61206422U
JP9174171A
JP8323434A
JP2001121226A
JP59024319U
JP57118811U
JP51071862U
JP7251226A
JP3070827U
JP56012522U
JP56023218U
JP56137827U
JP61205623U
JP62118700U
Attorney, Agent or Firm:
Norimitsu Nishimura