繊維可変密度を有する熱防護システム - Albany International Techniwave Incorporated

Title:

繊維可変密度を有する熱防護システム

Document Type and Number:

Japanese Patent JP4458510

Kind Code:

B2

Abstract:

A thermal protection system (TPM) for protecting a surface subject to high thermal load comprising a fiber substrate where the substrate is composed of woven or non-woven layers of fibers laminated together, or the substrate is formed by a process of three-dimensional weaving, wherein the fiber substrate has a variable density of fibers, with said density of fibers increasing across the thickness of the TPM, and further wherein the substrate is needled and coupled to an insulation backing.

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Inventors:

Moody henry

Application Number:

JP2002581354A

Publication Date:

April 28, 2010

Filing Date:

January 09, 2002

Export Citation:

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Assignee:

Albany International Techniwave Incorporated

International Classes:

B64G1/58; C04B35/80; B32B5/26; C04B35/528; C04B38/00; D03D1/00; D03D11/00; D03D15/12; D04H1/42; D06M15/41; D06M15/55; D06M15/643; F16L59/02

Domestic Patent References:

JP2000504093A
JP2227244A
JP62025094B1
JP5132359A
JP2258245A

Attorney, Agent or Firm:

Jyohei Yamashita

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