Title:
半導体装置及びその製造方法、並びにその応用装置
Document Type and Number:
Japanese Patent JP4458781
Kind Code:
B2
Inventors:
Keiji Fujimoto
Takaaki Negoro
Takaaki Negoro
Application Number:
JP2003197410A
Publication Date:
April 28, 2010
Filing Date:
July 15, 2003
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L21/28; H01L29/78; H01L21/8234; H01L21/8238; H01L27/088; H01L27/092; H01L29/423; H01L29/49
Domestic Patent References:
| JP8181223A | ||||
| JP60016469A | ||||
| JP7226509A | ||||
| JP2001118926A | ||||
| JP2000232224A | ||||
| JP11354647A | ||||
| JP2002270781A |
Attorney, Agent or Firm:
Shigeo Noguchi