Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
熱膨張性マイクロカプセルとその製造方法及びその利用方法
Document Type and Number:
Japanese Patent JP4460768
Kind Code:
B2
Abstract:
A heat-expandable microcapsule comprising a polymer shell formed by polymerizing (I) acrylonitrile, a main monomer component, (II) a monomer having carboxyl and (III) a monomer having groups reactive with the carboxyl of the monomer (II) and of a liquid having a boiling point lower than the softening point of the polymer and being encapsulated in the polymer shell. The heat-expandable microcapsules expand within high temperature range, 240 DEG C or above, and have heat-resistance.

Inventors:
Toshiyuki Shimazawa
Ichiro Takahara
Application Number:
JP2000533501A
Publication Date:
May 12, 2010
Filing Date:
February 23, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Matsumoto Yushi-Seiyaku Co., Ltd.
International Classes:
C09D7/12; B01J13/14; B01J13/18; C08F2/44; C08F220/44; C08J9/32; C08K9/10
Domestic Patent References:
JP5285376A
JP8500621A
JP7096167A
JP2303573A
JP6240040A
JP5329360A
JP62286534A
JP56113338A
Foreign References:
WO1999046320A1
US3615972
US4888241
Attorney, Agent or Firm:
Noriaki Miyakoshi