Title:
ダイを冷却するための熱電素子を有するマイクロエレクトロニクスアセンブリ及びその製造方法
Document Type and Number:
Japanese Patent JP4464974
Kind Code:
B2
Abstract:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.
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Inventors:
Ramanathan, Shri Ram
Chrysler, Gregory
Stephen, Thor
Chrysler, Gregory
Stephen, Thor
Application Number:
JP2006553163A
Publication Date:
May 19, 2010
Filing Date:
February 02, 2005
Export Citation:
Assignee:
Intel Corporation
International Classes:
H01L23/38; H01L21/48; H01L35/30; H01L35/32; H01L35/34
Domestic Patent References:
| JP2001257388A | ||||
| JP2003224309A | ||||
| JP11214598A | ||||
| JP1295449A | ||||
| JP2003332640A | ||||
| JP2002353520A |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Koichi Sugiyama
Shinsuke Onuki
Tadashige Ito
Koichi Sugiyama