Title:
半導体製造装置、排気管系および半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP4465342
Kind Code:
B2
Inventors:
Hidenari Yoshida
Koji Tomedsuka
Satoshi Taniyama
Mikio Ohno
Koji Tomedsuka
Satoshi Taniyama
Mikio Ohno
Application Number:
JP2006308583A
Publication Date:
May 19, 2010
Filing Date:
November 15, 2006
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/31; C23C16/44; H01L21/205; H01L21/22; H01L21/324
Domestic Patent References:
| JP2001226774A | ||||
| JP2002501671A | ||||
| JP63218719U | ||||
| JP4010617A | ||||
| JP2001126988A | ||||
| JP2000252273A | ||||
| JP2003068657A |
Attorney, Agent or Firm:
Kajiwara Tatsuya