Title:
半導体装置用基板の製造方法
Document Type and Number:
Japanese Patent JP4466169
Kind Code:
B2
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Inventors:
Satoshi Akimoto
Toshio Ofusa
Toshio Ofusa
Application Number:
JP2004109656A
Publication Date:
May 26, 2010
Filing Date:
April 02, 2004
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2001024331A | ||||
| JP2002271024A | ||||
| JP8139227A |