Title:
積層体およびこれを用いた多層配線板
Document Type and Number:
Japanese Patent JP4473486
Kind Code:
B2
Abstract:
A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.
Inventors:
Suguru Ito
Masayuki Hara
Hirosaku Nagano
Ken Nishinaka
Masayuki Hara
Hirosaku Nagano
Ken Nishinaka
Application Number:
JP2001574362A
Publication Date:
June 02, 2010
Filing Date:
April 12, 2001
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
B32B15/088; B32B27/06; H05K3/46; H05K3/38
Domestic Patent References:
| JP8186376A | ||||
| JP11148053A | ||||
| JP7062097A | ||||
| JP4046983A | ||||
| JP11236448A |
Foreign References:
| EP0603725A1 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita