Title:
ハイパーサンプル相関に基づくリソグラフィ処理の最適化
Document Type and Number:
Japanese Patent JP4481156
Kind Code:
B2
Abstract:
A method of optimizing lithographic processing to achieve substrate uniformity, is presented herein. In one embodiment, The method includes deriving hyper-sampled correlation information indicative of photoresist behavior for a plurality of wafer substrates processed at pre-specified target processing conditions. The derivation includes micro-exposing subfields of the substrates with a pattern, processing the substrates at the various target conditions, determining photoresist-related characteristics of the subfields (e.g., Bossung curvatures), and extracting correlation information regarding the subfield characteristics and the different target processing conditions to relate the target conditions as a function of subfield characteristics. The method then detects non-uniformities in a micro-exposed subsequent substrate processed under production-level processing conditions and exploits the correlation information to adjust the production-level conditions and achieve uniformity across the substrate.
Inventors:
Bernd Peter G
Roger Irwin
Eric Antony Janda
David Merit Phillips
Roger Irwin
Eric Antony Janda
David Merit Phillips
Application Number:
JP2004363660A
Publication Date:
June 16, 2010
Filing Date:
November 17, 2004
Export Citation:
Assignee:
AS M Netherlands B.V.
International Classes:
H01L21/027; G03F7/00; G03F7/20
Domestic Patent References:
| JP2002299205A | ||||
| JP7326563A | ||||
| JP2002124447A | ||||
| JP2003257838A | ||||
| JP2003100584A | ||||
| JP2003203837A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki