Title:
半導体封止材用微粒子および半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP4481672
Kind Code:
B2
Inventors:
Tomoyuki Kuwamoto
Shigefumi Kuramoto
Sasaki Rei Jin
Shigefumi Kuramoto
Sasaki Rei Jin
Application Number:
JP2004030902A
Publication Date:
June 16, 2010
Filing Date:
February 06, 2004
Export Citation:
Assignee:
Nippon Shokubai Co., Ltd.
International Classes:
C08L63/00; C08K9/04; C09C1/28; C09C3/10; H01L23/29; H01L23/31
Domestic Patent References:
| JP6232296A | ||||
| JP6283633A | ||||
| JP10265580A |
Attorney, Agent or Firm:
Katsuto Momii
Takehiko Matsumoto
Takehiko Matsumoto