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Title:
インプリント方法
Document Type and Number:
Japanese Patent JP4482047
Kind Code:
B2
Abstract:
According to one embodiment, an imprinting method includes applying a resist to a substrate, imprinting a stamper on which protruded patterns are formed against the resist applied to the substrate, forcing a distal end of a peeling wedge into a part between the substrate and the stamper, and introducing a gas between the substrate and the stamper to peel off the stamper from the substrate, in which a gap between the substrate and the stamper is made larger than a thickness of the resist at a part into which the distal end of the peeling wedge is forced.

Inventors:
Akiko Yuzawa
Masakazu Morita
Shinobu Sugimura
Masatoshi Sakurai
Application Number:
JP2008087763A
Publication Date:
June 16, 2010
Filing Date:
March 28, 2008
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
B29C59/02; B29C33/42; B81C99/00; G11B5/855; H01L21/027
Domestic Patent References:
JP2008012859A
JP2005166241A
JP2006040488A
JP2007294076A
JP2003203402A
JP2002260307A
JP2008012858A
JP2008221552A
JP2002288895A
Foreign References:
WO2006101235A1
WO2006106735A1
Attorney, Agent or Firm:
Takehiko Suzue
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Ryo Hashimoto
Tetsuya Kazama
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen



 
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