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Title:
電子部品実装用装置における基板下受装置
Document Type and Number:
Japanese Patent JP4483690
Kind Code:
B2
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Inventors:
Toshihiko Eiji
Application Number:
JP2005135552A
Publication Date:
June 16, 2010
Filing Date:
May 09, 2005
Export Citation:
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Assignee:
Panasonic Corporation
International Classes:
H05K13/04
Domestic Patent References:
JP7022794A
JP2005093766A
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
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