Title:
ヒートシンク装置及びその製造方法
Document Type and Number:
Japanese Patent JP4485511
Kind Code:
B2
Abstract:
The cooling body (122) has a thin metal layer (114) comprising surfaces that are arranged on corresponding sides opposite to each other. A semiconductor device (108a) e.g. silicon carbide base light emitting diode, is embedded in one of the surfaces, and has electrodes (110, 112) of different types of conductivities. Contact surfaces (128, 134) applied on the surface of the metal layer around the device, are connected with each of the electrodes, and are connectable to an external circuit. An independent claim is also included for a method for manufacturing an integrated metallic cooling body for a semiconductor device.
Inventors:
Su flame gon
Group of people
Hayashi Toshiyoshi
Yellow gold fountain
Hu Shukai
Group of people
Hayashi Toshiyoshi
Yellow gold fountain
Hu Shukai
Application Number:
JP2006321629A
Publication Date:
June 23, 2010
Filing Date:
November 29, 2006
Export Citation:
Assignee:
NATIONAL CHENG KUNG UNIVERSITY
International Classes:
H01L23/36; H01L33/62; H01L33/64; H01S5/022
Domestic Patent References:
| JP2000332343A | ||||
| JP9153646A | ||||
| JP2001176761A | ||||
| JP2001355075A | ||||
| JP5326831A |
Attorney, Agent or Firm:
Hiroshi Yamazaki
Mitsuo Tanaka
Atsushi Maeda
Mitsuo Tanaka
Atsushi Maeda