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Patent Searching and Data


Title:
半導体素子の製造方法
Document Type and Number:
Japanese Patent JP4496371
Kind Code:
B2
Inventors:
Takashi Ishigami
Michio Sato
Minoru Obata
Miyauchi
Kawai Mitsuo
Yamanobe Takashi
Maki Toshihiro
Noriaki Yagi
Shigeru Ando
Yoshiko Kohanawa
Application Number:
JP2005270372A
Publication Date:
July 07, 2010
Filing Date:
September 16, 2005
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
H01L21/285; C22B9/22; C22B34/12; C22C14/00; C23C14/34; H01L21/28; C22C5/04; C22C19/03; C22C19/07; C22C27/02; C22C27/04
Domestic Patent References:
JP5211326A
JP11317379A
JP2000306863A
JP2005020020A
JP60066425A
Other References:
今井富士雄,高純度チタンの精製と利用,チタニウム・ジルコニウム,1990年10月,Vol.38, No.4,P.185-188
南條道夫他2名,レアメタルの精製錬(I) チタン(III),レアメタルの精製錬(I),1986年12月,第42巻第2号,P.277-298
H.J.Maier,PREPARATION OF DUCTILE Zr FROM ZrO2,Nuclear Instruments and Methods in Physics Research,1989年,A282,P.113-115
S.C.Liang,Impurities in refractory metals/silicides,J. Vac. Sci. Technol.,1984年,B2(4),P.714-717
堂山昌男,純金属の役割り,金属,1985年 9月,第55巻第9号,P.2-7
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi