Title:
レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造
Document Type and Number:
Japanese Patent JP4498309
Kind Code:
B2
Abstract:
Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.
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Inventors:
Hideo Iwase
Application Number:
JP2006137088A
Publication Date:
July 07, 2010
Filing Date:
May 16, 2006
Export Citation:
Assignee:
Canon Inc
International Classes:
B23K26/00; B23K26/352; B23K26/36; G02B1/11; G02B1/118; G02B5/18; B23K101/40
Domestic Patent References:
| JP61063389A | ||||
| JP62220919A | ||||
| JP11170073A | ||||
| JP2000252610A | ||||
| JP2004038017A |
Attorney, Agent or Firm:
Tatsuya Nagao