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Patent Searching and Data


Title:
回路基板及びその製造方法並びに電子装置
Document Type and Number:
Japanese Patent JP4498835
Kind Code:
B2
Inventors:
藤井 暁義
齊藤 裕一
Application Number:
JP2004185264A
Publication Date:
July 07, 2010
Filing Date:
June 23, 2004
Export Citation:
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Assignee:
シャープ株式会社
International Classes:
G02F1/1343; H05K1/09; G02F1/1368; H01L21/28; H01L21/288; H01L21/3205; H01L23/52; H01L29/786; H05K3/10
Domestic Patent References:
JP2003023233A
JP2001024088A
JP5029736A
JP11204529A
JP2003080694A
JP2003031914A
Attorney, Agent or Firm:
特許業務法人原謙三国際特許事務所
原 謙三
木島 隆一
金子 一郎