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Title:
電子部品装着装置
Document Type and Number:
Japanese Patent JP4503873
Kind Code:
B2
Abstract:
The invention provides a mounting apparatus with a beam (6) which is free from adverse effect on its performance due to thermal distortion and misalignment of its guide rails, on which the beam (6) for mounting operation travels. One end of the beam (6) is rotatably supported on a slide, which moves along the guide rails. Another end of the beam (6) is also rotatably supported on another slider through a moving element (47). The slider and the mounting element (47) move along the guide rail. The moving element (47) moves in a direction perpendicular to the guide rails.

Inventors:
Katsuyuki Seto
Yoshiharu Fukushima
Application Number:
JP2001100872A
Publication Date:
July 14, 2010
Filing Date:
March 30, 2001
Export Citation:
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Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
B25J15/06; H05K13/04
Domestic Patent References:
JP3221385A
JP5096479A
JP11163599A
Attorney, Agent or Firm:
Kiyotaka Aizawa



 
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