Title:
電子部品用集合基板及び電子部品の製造方法
Document Type and Number:
Japanese Patent JP4504075
Kind Code:
B2
Inventors:
Osamu Matsukawa
Takahiro Wakasa
Takahiro Wakasa
Application Number:
JP2004120534A
Publication Date:
July 14, 2010
Filing Date:
April 15, 2004
Export Citation:
Assignee:
Kamaya Electric Co., Ltd.
International Classes:
H01C1/142; H01C17/06
Domestic Patent References:
| JP2003178906A | ||||
| JP2001210926A | ||||
| JP11340002A | ||||
| JP2003197404A |
Attorney, Agent or Firm:
Hajime Sakai
Masahiro Kurai
Masahiro Kurai