Title:
太陽電池用リード線半田付け装置
Document Type and Number:
Japanese Patent JP4504485
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead wire soldering apparatus for solar cell which can smoothly supply a lead wire to a lead wire mounting region of the cell and can perform automatic connection of the leading wire to a soldering bump formed in the lead wire mounting region. SOLUTION: The lead wire mounting apparatus for solar cell for mounting lead wires 11 to a lead wire mounting region of a solar cell 1 includes a mount 12 for mounting the solar cell 1 having a row of solder bumps formed thereon onto the lead wire mounting region, a lead wire supply 12 for continuously guiding the lead wires 11 onto the row of soldering bumps of the cell 1, a least guide surface of the mount 12 being made of a material having a small friction coefficient, and a lead wire soldering iron 31 for pushing the lead wires 11 against the soldering bumps to connect the lead wires to the bumps.
Inventors:
Toshihide Ohkatsu
Application Number:
JP30553399A
Publication Date:
July 14, 2010
Filing Date:
October 27, 1999
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
B23K1/00; H01L31/04; B23K3/02; B23K3/06; B23K101/38
Domestic Patent References:
| JP11087756A | ||||
| JP6350115A | ||||
| JP10034323A | ||||
| JP60202968A |
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara