Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4506767
Kind Code:
B2
Abstract:
A semiconductor device comprising: a semiconductor substrate which has a plurality of connection pads on a top surface thereof; an insulating film which is provided on the semiconductor substrate and which has a plurality of openings formed at portions corresponding to the connection pads; a plurality of re-wirings each of which is provided to be connected to one of the connection pads via one of the openings of the insulating film; a re-wiring upper layer insulating film which is filled between the re-wirings on a top surface of the insulating film, and which is provided such that a top surface thereof is as high as or higher than a top surface of the re-wirings; and a plurality of columnar electrodes each of which is provided to be connected to a top surface-side connection pad section of each of the re-wirings.
Inventors:
Miyamoto Tsutomu
Application Number:
JP2007050001A
Publication Date:
July 21, 2010
Filing Date:
February 28, 2007
Export Citation:
Assignee:
CASIO COMPUTER CO.,LTD.
International Classes:
H01L23/12
Domestic Patent References:
| JP2004158758A | ||||
| JP2006318943A | ||||
| JP2003124394A | ||||
| JP2004349610A | ||||
| JP2000261141A | ||||
| JP9036522A | ||||
| JP2006216919A |