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Title:
不揮発性記憶装置を含む半導体装置
Document Type and Number:
Japanese Patent JP4507023
Kind Code:
B2
Abstract:

To provide a semiconductor device including a plurality of nonvolatile memories in which the operating speed can be enhanced while reducing the area of a peripheral circuit.

This semiconductor device includes a plurality of nonvolatile memories 100 arranged in the row direction and the column direction intersecting the row direction. The nonvolatile memory 100 includes a gate insulation layer 22 provided on the channel region of a semiconductor layer 10, a gate conductive layer 14 provided on the gate insulation layer 22, first conductivity type first and second impurity regions 34 and 24, and a bit conductive layer 80. The bit conductive layer 80 connects the second impurity regions 24 of the memory cell 100 arranged in i rows and [j+1] columns electrically with the first impurity regions 34 of the memory cell 100 arranged in [i+1] rows and [j+1] columns. A charge storage region is provided in the vicinity of one end part of the gate conductive layer 14 in a charge capturing layer 22b and not provided in the vicinity of the other end part thereof.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Akihiko Ebina
Application Number:
JP2009277361A
Publication Date:
July 21, 2010
Filing Date:
December 07, 2009
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H01L21/8247; H01L27/115; H01L29/788; H01L29/792
Domestic Patent References:
JP7193151A
JP9082921A
JP2000371A
JP11345888A
JP2004095893A
JP2004296683A
JP2003068896A
JP6188428A
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Misa Nagata