Title:
耐ハロゲンガス性の半導体加工装置用部材
Document Type and Number:
Japanese Patent JP4512603
Kind Code:
B2
Inventors:
Yoshio Harada
Takema Teratani
Takema Teratani
Application Number:
JP2007046210A
Publication Date:
July 28, 2010
Filing Date:
February 26, 2007
Export Citation:
Assignee:
Tocalo Co., Ltd.
International Classes:
C23C28/00; C23C14/48; H01L21/3065
Domestic Patent References:
| JP10219426A | ||||
| JP10219427A | ||||
| JP62103380A | ||||
| JP2002252209A | ||||
| JP8181048A | ||||
| JP4066657A | ||||
| JP2002038252A | ||||
| JP2002083861A | ||||
| JP2000219574A |
Attorney, Agent or Firm:
Yoshiyuki Kaji
Makoto Suhara
Makoto Suhara