Title:
半導体制御装置
Document Type and Number:
Japanese Patent JP4514278
Kind Code:
B2
Inventors:
Akira Watanabe
Application Number:
JP2000074102A
Publication Date:
July 28, 2010
Filing Date:
March 16, 2000
Export Citation:
Assignee:
Toyo Denki Manufacturing Co., Ltd.
International Classes:
H02M7/12; H02M7/48; H02M1/00
Domestic Patent References:
| JP6217558A |