To provide an organic vapor deposition method and a system therefor by which a film deposition rate can be controlled accurately by preventing the variation in an evaporation rate caused by the position of an evaporation source.
The organic vapor deposition system is provided with: a vacuum tank 2; an evaporation source 3 for an organic material composed so as to move between a waiting position and a film deposition position in the vacuum tank 2; and a film thickness sensor 50 for measuring the evaporation rate of vapor evaporated from the evaporation source 3 in the waiting position, and is composed in such a manner that the organic evaporation material is vapor-deposited on a substrate 5 as the evaporation rate in the evaporation source 3 is controlled based on the result obtained in the film thickness sensor 50. Sticking prevention members 7 each composed of a material having an emissivity equal to that of each mask 6 is arranged at almost the same height as that of each mask, further, the sticking prevention members 7 are cooled so as to make their temperature to that of each mask 6, and the loss of the radiant heat in the vicinity of the vapor release part in the evaporation source 3 is made equal in the waiting time and the film deposition time.
COPYRIGHT: (C)2006,JPO&NCIPI
Toshihiro Okada
Hisazo Nakamura
Yoshio Sunaga
| JP2004107763A | ||||
| JP2004091919A |
Shigeo Ishijima