Title:
化学増幅型レジスト組成物及びそれを用いたパターン形成方法
Document Type and Number:
Japanese Patent JP4524154
Kind Code:
B2
Abstract:
The present invention relates to a chemical amplification resist composition comprising:
(A) a resin increasing the solubility in an alkali developer by the action of an acid;
(B) a compound capable of generating an acid upon irradiation with actinic ray or radiation;
(C) a compound having a pKa value of 4-15 selected from formulae (FAD-II) and (FAD-III):
wherein
R a105 each individually is F or perfluoroalkyl;
n is 1 or 2, and (n+m) = 6;
R a106 each individually is F or perfluoroalkyl; and
A a102 is a bond or a divalent organic group; and
(D) a solvent. Also, the invention relates to a pattern-forming method comprising; forming a resist film with the above composition and exposing and developing the resist film
More Like This:
Inventors:
Shinji Tarutani
Takahashi table
Kenji Wada
Takahashi table
Kenji Wada
Application Number:
JP2004238040A
Publication Date:
August 11, 2010
Filing Date:
August 18, 2004
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; G03F7/004; H01L21/027
Domestic Patent References:
| JP2003287890A | ||||
| JP2003156845A | ||||
| JP2003177539A | ||||
| JP2004102264A | ||||
| JP2004184859A | ||||
| JP2005128146A |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa