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Title:
光接続装置の製造方法
Document Type and Number:
Japanese Patent JP4524390
Kind Code:
B2
Abstract:

To make connection possible always stably and with a high coupling efficiency without being affected with the height of VCSEL wire mounted on a substrate, by further developing the technique of a self-forming waveguide for which reports are few on applications to an optical circuit at present.

A light emitting element 10 is covered with a photosensitive medium 9 in a manner covering the entirety (S1); a hole array 20 is placed on the light emitting element 10 so as to enclose the photosensitive medium 9 inside (S2) and is then aligned (S3), wherein the hole array 20 is equipped with a spacer 27 having the ability of surrounding the light emitting element 10 and having a height giving no hindrance to the mounting, and is also equipped, on the upper face 21 of the spacer, with a hole part 23 having a prescribed size; the photosensitive medium 9 is formed with an optical waveguide 24 by irradiating the hole array 20 with ultraviolet rays from the above (S4); and thereafter, a cover member 30 is removed (S5).

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Osamu Mikami
Yusuke Oyama
Hideaki Ozawa
Satoshi Ito
Yusuke Obata
Application Number:
JP2005037200A
Publication Date:
August 18, 2010
Filing Date:
February 15, 2005
Export Citation:
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Assignee:
Tokai University
International Classes:
G02B6/42; H01S5/022
Foreign References:
WO2004063785A1
Attorney, Agent or Firm:
Seiichi Saito



 
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