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Patent Searching and Data


Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP4536007
Kind Code:
B2
Inventors:
西川 英敏
Application Number:
JP2005513145A
Publication Date:
September 01, 2010
Filing Date:
July 15, 2004
Export Citation:
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Assignee:
ローム株式会社
International Classes:
H03K5/13; H03K23/54; H03M9/00
Domestic Patent References:
JPH08256044A
JPH0225110A
JPS5121466A
JPS63108747A
Attorney, Agent or Firm:
佐野 静夫