Title:
フレキシブルプリント配線基板の配線パターン検査方法および検査装置
Document Type and Number:
Japanese Patent JP4536033
Kind Code:
B2
Abstract:
In a method for inspecting a wiring pattern on a flexible printed wiring board, light is illuminated from a front surface side of the TAB tape T while a drum is provided on the rear surface side of the TAB tape T such that a reflection method becomes main and a transmission method becomes subordinate, and when imaging a wiring pattern image of an inspection part D on the front surface side, it becomes possible to determine the quality of a wiring pattern taking advantage of the reflection method. Furthers by utilizing the indirect transmission light, defects of a short-circuiting type on the light permeable insulating film that are difficult to be detected with the reflection method can be detected as darker defects than the light permeable insulating film by the transmission method.
Inventors:
Tetsuyuki Narabayashi
Application Number:
JP2006150078A
Publication Date:
September 01, 2010
Filing Date:
May 30, 2006
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
G01B11/24; G01N21/956; H05K3/00
Domestic Patent References:
| JP2004527734A | ||||
| JP2138669A | ||||
| JP2006112845A | ||||
| JP2002369044A | ||||
| JP2003279498A | ||||
| JP6123713A |
Attorney, Agent or Firm:
Hiroaki Sakai