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Patent Searching and Data


Title:
配線基板およびこれを用いた半導体装置
Document Type and Number:
Japanese Patent JP4540262
Kind Code:
B2
Inventors:
春田 健一郎
井上 貴志
Application Number:
JP2001197518A
Publication Date:
September 08, 2010
Filing Date:
June 28, 2001
Export Citation:
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Assignee:
京セラ株式会社
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
JP2000114722A
JP8506696A