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Title:
積層型セラミック素子及びその実装構造
Document Type and Number:
Japanese Patent JP4548466
Kind Code:
B2
Inventors:
富樫 正明
Application Number:
JP2007246198A
Publication Date:
September 22, 2010
Filing Date:
September 21, 2007
Export Citation:
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Assignee:
TDK株式会社
International Classes:
H01C7/04; H01F27/00; H01G4/12; H01G4/40; H01G7/04; H01G17/00
Domestic Patent References:
JP6251993A
JP2001023864A
JP5101964A
Attorney, Agent or Firm:
長谷川 芳樹
寺崎 史朗
青木 博昭



 
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