Title:
セラミック配線基板の製造方法
Document Type and Number:
Japanese Patent JP4548895
Kind Code:
B2
Inventors:
Kei Hayashi
Application Number:
JP2000089596A
Publication Date:
September 22, 2010
Filing Date:
March 28, 2000
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B32B15/01; H05K3/20; B32B15/04; B32B37/16; H05K3/38
Domestic Patent References:
| JP11204941A | ||||
| JP2000071387A | ||||
| JP63299195A | ||||
| JP11157952A |