Title:
スパッタリングターゲット材の製造方法
Document Type and Number:
Japanese Patent JP4549347
Kind Code:
B2
Abstract:
The provided is a sputtering target material that is made not to cause an arcing phenomenon and splash phenomenon at the time of sputtering as completely as possible. A portion to be used for sputtering of the sputtering target material is subjected to a friction stir processing. Even with a sputtering target material made of a carbon-containing aluminum alloy or a large-sized sputtering target material, the arcing phenomenon and the splash phenomenon at the time of sputtering can be certainly suppressed.
Inventors:
Kato Kasho
Kubota Takashi
Hiroshi Kimura
Matsuura Yoshinori
Kenji Matsuzaki
Kubota Takashi
Hiroshi Kimura
Matsuura Yoshinori
Kenji Matsuzaki
Application Number:
JP2006528999A
Publication Date:
September 22, 2010
Filing Date:
July 08, 2005
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
NIPPON LIGHT METAL COMPANY,LTD.
NIPPON LIGHT METAL COMPANY,LTD.
International Classes:
C23C14/34
Domestic Patent References:
| JP2004307906A | 2004-11-04 |
Attorney, Agent or Firm:
Patent business corporation Tanaka, Okazaki and Associates