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Title:
ポリイミド系多層フィルムの製造方法、およびこれにより得られるポリイミド系多層フィルム
Document Type and Number:
Japanese Patent JP4555706
Kind Code:
B2
Abstract:

To provide a technique for preventing the pin removing failure in a polyimide multilayered film after baking in manufacturing the polyimide multilayered film by a casting film forming method while enhancing the peelability of a multilayered gel film from a support even in a case that the peelability of the multilayered film from the support is enhanced by employing a chemical imidation method and effectively avoiding the ply separation of the multilayered gel film.

For example, in a case that a multilayered liquid film 30 comprising thermoplastic polyimide varnish/heat-resistant polyimide varnish/thermoplastic polyimide varnish is formed on an endless belt and converted to the multilayered gel film 40, a liquid film 32 comprising the heat-resistant polyimide varnish is formed as a wide liquid film of which the width is larger than that of each of other liquid films 31 and 33 and both end parts of the multilayered liquid film 30 are formed into a single-layered structure composed only of the wide liquid film. In this case, it is preferable to use a multilayered coextrusion die wherein an inner deckle is inserted in a flow channel. The multilayered gel film 40 may be baked in a state that a tenter pin 17 is thrust in the end part of the single-layered structure to fix the single-layered structure.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Kenji Ueshima
Yanagi Masami Tadashi
Application Number:
JP2005056654A
Publication Date:
October 06, 2010
Filing Date:
March 01, 2005
Export Citation:
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Assignee:
Kaneka Corporation
International Classes:
B29C47/06; B32B27/34; B29L7/00
Domestic Patent References:
JP2946416B2
JP8224843A
JP11005244A
JP3026648A
JP62116821U
Attorney, Agent or Firm:
Kenzo Hara International Patent Office